| 摘要 |
<p>A method and an apparatus for fabricating a silicon mold by using silicon powders are provided to increase electrical resistivity and strength by performing only a dry process without using a binder and performing a cleaning process. A die(21) is filled with silicon powders(22). An upper punch(23a) and a lower punch(23b) are used for pressing the silicon powders within the die. An inductive coil(24) is positioned around the die to apply heat to the silicon powders within the die. A hydraulic unit operates the upper punch and the lower punch for applying the pressure to the silicon powders. A vacuum unit maintains a vacuum state of a chamber including the silicon powders, a die assembly, and the inductive coil. A control unit controls operations of the die, the upper punch, the lower punch, the inductive coil, the hydraulic unit, and the vacuum unit.</p> |
