首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
屋面钛金瓦(长条凸形)
摘要
申请公布号
CN300835174D
申请公布日期
2008.10.01
申请号
CN200730302157.0
申请日期
2007.09.13
申请人
丁成志
发明人
丁成志
分类号
25-01
主分类号
25-01
代理机构
代理人
主权项
地址
610041四川省阿坝县阿坝镇中心三巷26号
您可能感兴趣的专利
ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
CRYSTALLINE MULTILAYER STRUCTURE AND SEMICONDUCTOR DEVICE
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
TRANSISTORS WITH A GATE INSULATION LAYER HAVING A CHANNEL DEPLETING INTERFACIAL CHARGE
Memory Cells, Memory Arrays, and Methods of Forming Memory Cells and Arrays
INTEGRATED CIRCUITS HAVING MAGNETIC TUNNEL JUNCTIONS (MTJ) AND METHODS FOR FABRICATING THE SAME
LIGHT-EMITTING DIODE WITH A PLURALITY OF LIGHT-EMITTING ELEMENTS AND METHOD FOR MANUFACTURING SAME
PHOTOELECTRIC CONVERSION DEVICE, METHOD FOR PRODUCING PHOTOELECTRIC CONVERSION DEVICE, AND IMAGE PICKUP SYSTEM
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY DEVICE
SEMICONDUCTOR DEVICE
METHOD FOR MANUFACTURING LIGHT-EMITTING DISPLAY DEVICE
DISPLAY AND ELECTRONIC APPARATUS
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME
Semiconductor Device
ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF
RADIUSED ALIGNMENT POST FOR SUBSTRATE MATERIAL
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE FABRICATED BY THE METHOD
SYSTEM AND APPARATUS FOR HOLDING A SUBSTRATE OVER WIDE TEMPERATURE RANGE