TEST EQUIPMENT OF FBGA PACKAGE

摘要

Test equipment of an FBGA(Ball Grid Array) package is provided to reduce time and cost by removing additional adapters and package guides according to sizes of the FBGA packages. A socket board(302) has a circuit to exchange an electrical signal with an FBGA package(320). A pogo pin plate(304) is arranged on the socket board and has a plurality of pogo pins(306) which are in contact with solder balls(322) of the FBGA package to exchange the electrical signal between the socket board and the FBGA package. An adapter(308) has a plurality of holes through which the pogo pins pass and supports the FBGA package. Elastic members(312) are interposed between the pogo pin plate and the adapter. A cover(314) presses the FBGA package to contact the pogo pins with the solder balls of the FBGA package.