| 摘要 |
<p>PURPOSE:To prevent flow of potting resin even if a small-sized board is used and to form the upper surface substantially flat by providing an annular flow stop preventive frame covering an IC chip and having a flat upper surface, and the resin covering a wire bonding part in the frame. CONSTITUTION:A printed board 11 and a spacer of its upper part are secured, and potting resins 18 are filled from the upper surfaces of respective flow stop preventive frames 13. The resin 18 has heat resistance durable against the temperature of a reflowing solder tank, and resin capable of formed in a thick film such as PPS resin is used. When the resin 18 is mounted, in its each electronic device, flow of the resin therearound can be prevented by the frame 13, the resin is hence contained in a narrow range, and its upper surface becomes substantially flat. Thus, the board can be reduced in size, the flow of the resin is prevented, and the upper surface can be made substantially flat.</p> |
