| 摘要 |
<p>A positive resist composition, includes: (A) a resin having a property of becoming soluble in an alkali developer under an action of an acid and having a phenolic hydroxyl group and a weight average molecular weight of 1,500 to 3,500; and (B) a compound capable of generating a sulfonic acid upon irradiation with actinic rays or radiation, wherein a ratio of dissolution rates of an exposed area and an unexposed area in an aqueous 2.38 wt% tetramethylammonium hydroxide at 23°C under atmospheric pressure is in a range from 200 to 5,000 times, and a pattern forming method uses the composition.</p> |
