| 发明名称 |
Methods for stripping material for wafer reclamation |
| 摘要 |
<p>Removal compositions and processes for removing at least one material layer from a rejected microelectronic device structure having same thereon. The removal composition includes hydrofluoric acid. The composition achieves substantial removal of the material(s) to be removed while not damaging the layers to be retained, for reclaiming, reworking, recycling and/or reuse of said structure.</p> |
| 申请公布号 |
EP1975987(A2) |
申请公布日期 |
2008.10.01 |
| 申请号 |
EP20080103209 |
申请日期 |
2008.03.31 |
| 申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. |
发明人 |
VISINTIN, PAMELA M.;JIANG, PING;KORZENSKI, MICHAEL B.;KING, MACKENZIE;FLETCHER, KRISTIN A.;MINSEK, DAVID W. |
| 分类号 |
H01L21/02;H01L21/311;H01L21/3213 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
