| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of ensuring an electric conduction from a side face. SOLUTION: Protection films 20A, 20B of a plurality of layers are provided on an active element forming face 18 of a semiconductor chip 10. The protection films 20A, 20B are formed with a polyimide resin, to have the flexibility. Terminals 14A, 14B which are electrically connected onto electrode pads 12A, 12B are provided away from the active element forming face 18. The terminals 14A, 14B are exposed from side faces 28A, 28B of the protection films 20A, 20B. |
