| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is excellent in electrical characteristic by avoiding the occurrence of delamination between layers inside of the wiring board, avoiding occurrence of deformation, crack, etc., at the site of a through hole formed at a metal foil, and lowering the electric resistance of an inner layer wiring conductor layer when the metal foil and a glass ceramic green sheet which constitute an inner layer wiring conductor layer are baked simultaneously. SOLUTION: Inside of an insulation base body 10 constituted by laminating a plurality of glass ceramic layers 10a to 10d, the inner layer wiring conductor layer 6 consisting of the metal foil having a plurality of through holes 11 formed and a metallize part charged into the through holes 11 is formed. COPYRIGHT: (C)2004,JPO |
