| 摘要 |
A lead-free alloy for soldering is provided to mix Ag, Cu, P, and Ka with Sn for increasing mechanical features and reducing dross amount when manufacturing the lead-free solder. A lead-free alloy for soldering contains 0.1 to 6.0 weight% of Ag, 0.05 to 7.5 weight% of Cu, 0.001 to 3.0 weight% of P, 0.001 to 0.5 weight% of Ka, and the rest of Sn. 0.1 to 10 weight% of Bi is contained in the lead-free alloy. |
