A semiconductor package is provided to reduce a total thickness thereof by inserting a semiconductor chip into a cavity formed in an upper part of a printed circuit board. A printed circuit board(10) has a single layer structure or a multistage structure. A cavity is formed on an upper surface of the printed circuit board. A conductive pattern(28) for exchanging signals is exposed from a surface within the cavity. A semiconductor chip is inserted and loaded into the cavity. The semiconductor chip is connected with the conductive pattern by using a flip chip bump. A heat-radiating unit(40) is attached on an upper surface of the semiconductor chip by using an adhesive and is closely attached to an upper surface of the printed circuit board.
