| 摘要 |
TO REDUCE SWITCHING NOISE, THE POWER SUPPLY TERMINALS OF AN INTEGRATED CIRCUIT DIE (40) ARE COUPLE TO THE RESPECTIVE TERMINALS OF AT LEAST ONE CAPACITOR (50) EMBEDDED IN AN INTERPOSER (50) THAT LIES BETWEEN THE DIE (40) AND A SUBSTRATE (60). IN ONE EMBODIMENT, THE INTERPOSER (50) IS A MULTILAYER CERAMIC STRUCTURE THAT COUPLES POWER AND SIGNAL CONDUCTORS ON THE DIE (40) TO CORRESPONDING CONDUCTORS ON THE SUBSTRATE (60) . THE CAPACITOR (55) IS FORMED OF AT LEAST ONE HIGH PERMITTIVITY LAYERS (53) AND IN AN EMBODIMENT COMPRISES SEVERAL HIGH PERMITTIVITY LAYER (53) INTERLEAVED WITH CONDUCTIVE LAYERS. ALTERNATIVELY, THE CAPACITOR CAN COMPRISE AT LEAST ONE EMBEDDED DISCRETE CAPACITOR. ALSO DESCIRBED ARE AN ELECTRONIC SYSTEM, A DATA PROCESSING SYSTEM, AND VARIOUS METHODS OF MANUFACTURE.FIG.2 |
