发明名称 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 It is an object to provide a printed circuit board comprised of an insulating layer; a plurality of electrodes that are implanted into a portion on a side of a surface of the insulating layer, wherein the electrodes and the surface of the insulating layer compose a component mounting surface; a resisting member formed on a resisting member forming region including each partial region of the surface of the electrodes in the component mounting surface; and an external connecting conductive pattern formed in separation from the resisting member with a gap on a region including the partial region of the surface of the electrodes that is not in the resisting member forming region on the component mounting surface. Thus, a resisting element with a high, stable and precise resistance and a printed circuit board with such a resisting element can be provided.
申请公布号 KR20080087083(A) 申请公布日期 2008.09.30
申请号 KR20087013249 申请日期 2007.08.02
申请人 IBIDEN CO., LTD. 发明人 TAKAHASHI MICHIMASA;MIKADO YUKINOBU;YANAGISAWA HIROYUKI
分类号 H05K1/18;H05K1/02;H05K3/30;H05K3/46 主分类号 H05K1/18
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