| 发明名称 |
Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same |
| 摘要 |
A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like, the composition including at least two fluoropolymers and two inorganic fillers. A circuitized substrate including at least one such dielectric layer and at least one conductive layer thereon is also provided. |
| 申请公布号 |
US7429789(B2) |
申请公布日期 |
2008.09.30 |
| 申请号 |
US20060390386 |
申请日期 |
2006.03.28 |
| 申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
JAPP ROBERT M.;MARKOVICH VOYA R.;PAPATHOMAS KOSTAS I. |
| 分类号 |
H01L21/31;H01L21/44;H01L21/48;H01L21/50;H01L23/14;H01L23/48;H01L23/492;H01L23/498;H01L23/52;H01L29/40;H05K1/03;H05K3/00;H05K3/46 |
主分类号 |
H01L21/31 |
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