Semiconductor structure and method of manufacture

摘要

A semiconductor structure ( 100 ) includes a substrate ( 110 ) having a first surface ( 111 ) with a mold lock feature ( 101 ). The semiconductor structure also includes a semiconductor chip ( 120 ) located over the first surface of the substrate. The semiconductor structure further includes an electrical isolator structure ( 340 ) located over the first surface of the substrate. The electrical isolator structure includes an electrical lead ( 341, 342 ) and an electrically insulative element ( 343 ) molded to the electrical lead. An optional portion ( 444 ) of the electrical isolator structure is located in the mold lock feature. The semiconductor structure additionally includes an adhesive element ( 450 ) located between and coupling the electrical isolator structure and the first surface of the substrate.