| 摘要 |
A lead frame and a semiconductor package therefor are provided to prevent a wire from being disconnected by preventing a lead from being separated from a sealing resin. A lead frame(11) includes a stage(13), plural leads(14), and plural dam bars(15). A semiconductor device(12) is mounted on the stage. The leads are arranged to surround the stage and include inner ends(14a), which are elongated inwards toward the stage. The dam bars are arranged around the stage and the lead. Four corners of the dam bars are contacted with the stage through connection leads(13a), such that the dam bars are fixed on the stage. Outer ends(14b) of the leads are directly contacted with the dam bars. Slits(16) are formed to be parallel to each other on an outer surface of the dam bar. |
