发明名称 Pitch reduction
摘要 A method for providing features in an etch layer is provided. A sacrificial patterned layer with sacrificial features is provided over an etch layer. Conformal sidewalls are formed in the sacrificial features, comprising at least two cycles of a sidewall formation process, wherein each cycle comprises a sidewall deposition phase and a sidewall profile shaping phase. Parts of the sacrificial patterned layer between conformal sidewalls are removed leaving the conformal sidewalls with gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed. Features are etched in the etch layer using the conformal sidewalls as an etch mask, wherein the features in the etch layer are etched through the gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed.
申请公布号 US7429533(B2) 申请公布日期 2008.09.30
申请号 US20060432194 申请日期 2006.05.10
申请人 LAM RESEARCH CORPORATION 发明人 HUANG ZHISONG;MARKS JEFFREY;SADJADI S. M. REZA
分类号 H01L21/311;H01L21/306 主分类号 H01L21/311
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