发明名称 Memory package
摘要 A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.
申请公布号 US7429781(B2) 申请公布日期 2008.09.30
申请号 US20060339866 申请日期 2006.01.25
申请人 SANDISK CORPORATION 发明人 WALLACE ROBERT F.
分类号 H01L23/02;G06K19/077;H01L21/50;H01L25/065;H01L25/18 主分类号 H01L23/02
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