MICROELECTRONIC COMPONENT ASSEMBLIES WITH RECESSED WIRE BONDS AND METHODS OF MAKING SAME

摘要

A microelectronic component assembly (100) includes a microelectronic component, such as a semiconductor chip (110) mounted via adhesive (135a, 135b) to a bottom surface (130) of a substrate (120). The substrate has a recess (132) extending from the top surface (128) part way through the substrate thereby forming shoulders (124a, 124b) on which are located bond pads (144). There is a window opening (134) between the bond pads extending the rest of the way through the substrate which exposes the terminals (114) on the active surface (112) of the microelectronic component. Bond wires (140) connect the terminals (114) to the bond pads (144). The bond wires have a maximum height (L) above the active surface of the microelectronic component which does not exceed the height (HI) of the top surface of the substrate above the active surface of the microelectronic component. Solder bumps (220) may be formed on contacts (129) on the top surface of the substrate, to allow connections to the microelectronic component via the bond pads and the wire bonds.