| 摘要 |
Disclosed is a polyimide resin adhesive containing (a) a solvent-soluble polyimide and (b) at least one of alkylated melamine resins and alkylated urea resins. Also disclosed is a metal polyimide laminate obtained by using such a polyimide resin adhesive. The polyimide resin adhesive enables to form a laminate which exhibits high metal foil peel strength, while having adequate heat resistance and flame retardance. Also disclosed are a metal polyimide laminate using such a polyimide resin adhesive and a printed wiring board using such a metal polyimide laminate. |
