ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM MADE WITH THE SAME, SUBSTRATE FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR DEVICE

摘要

An adhesive composition which comprises (a) an epoxy resin, (b) a hardener, and (c) a polymer incompatible with the epoxy resin and optionally contains (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition which comprises mixing (a) an epoxy resin with (b) a hardener and (d) a filler and then mixing the resultant mixture with (c) a polymer incompatible with the epoxy resin; an adhesive film obtained by forming the adhesive composition into a film; a substrate for semiconductor mounting which comprises a wiring board and the adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device produced with the adhesive film or the substrate.