A METHOD OF FABRICATING A WAFER WITH STRAINED CHANNEL LAYERS FOR INCREASED ELECTRON AND HOLE MOBILITY FOR IMPROVING DEVICE PERFORMANCE

摘要

A METHOD OF FABRICATING A WAFER WITH STRAINED CHANNEL LAYERS FOR INCREASED ELECTRON AND HOLE MOBILITY FOR IMPROVING DEVICE PERFORMANCE A method for making a SOI wafer with a strained silicon layer for increased electron and hole mobility is achieved. The method forms a porous silicon layer on a seed wafer. A H2 anneal is used to form a smooth surface on the porous silicon. A strain free (relaxed) epitaxial Six Ge1-x layer is deposited and a bonding layer is formed. The seed wafer is then bonded to a handle wafer having an insulator on the surface. A spray etch is used to etch the porous Si layer resulting in a SOI handle wafer having portions of the porous Si layer on the relaxed Six Ge1-x. The handle wafer is then annealed in H2 to convert the porous Si to a smooth strained Si layer on the relaxed SiGe layer of the SOI wafer.