| 摘要 |
<p>Method For Etching Dual Damascene Structures In Organosilicate Glass A method for forming a dual damascene etch structure in a wafer, the wafer including a layer of organosilicate glass dielectric, the method comprising the steps of: first, etching through a major portion of the organosilicate glass dielectric utilizing a first, low selectivity etchant, the first etching step leaving a remainder portion of the organosilicate glass dielectric, wherein the low selectivity etchant is selected from the group of etchant mixtures consisting of and second, etching away the remainder portion of the organosilicate glass dielectric utilizing a second, highly selective etchant, wherein the high selectivity etchant is a mixture of</p> |
