| 发明名称 |
SEMICONDUCTOR PACKAGE SINGULATING SYSTEM AND METHOD |
| 摘要 |
<p>An embodiment of the invention discloses a saw jig (22) for supporting a substrate (26) on a compressible support pad (30). A clamp (24) is mountable onto the saw jig (22) for clamping the substrate therebetween without impeding access of a saw blade (68) to the substrate (26). Vacuum through channels (32) formed in the support pad (30) and saw jig (22) generates suction forces for positionally immobilising the substrate (26) in combination with the clamping forces of the clamp (24) during singulation of the substrate (26) by the saw blade (68).</p> |
| 申请公布号 |
SG145540(A1) |
申请公布日期 |
2008.09.29 |
| 申请号 |
SG20040013371 |
申请日期 |
2004.03.12 |
| 申请人 |
ADVANCED SYSTEMS AUTOMATION LIMITED |
发明人 |
LIU, FULIN;LIM, KOK YEOW EDDY;CHEW, HWEE SENG JIMMY |
| 分类号 |
H01L21/78;H01L21/00;(IPC1-7):H01L21/00;B28D5/00 |
主分类号 |
H01L21/78 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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