CUTTING AND PROCESSING METHOD FOR IR CUT-OFF FILTER, AND FRAME STRUCTURE FOR THE SAME

摘要

A cutting method for an infrared cut-off filter and a frame structure for the same are provided to reduce material cost by dicing four wafers at a time through one frame. A cutting method for an infrared cut-off filter includes the steps of: mounting a wafer(120) having a predetermined size on a frame(300); attaching a dicing tape to one surface of the mounted wafer; dicing the taped wafer along a predetermined line by using a dicing unit; performing a spin drying process by rotating the diced wafer at high speed through centrifugal drying and cleaning the surface of the wafer to remove particles generated when dicing the wafer; and irradiating ultraviolet rays to deteriorate adhesive force so that the attached dicing tape is easily separated. The wafer is one wafer formed by aligning or coupling four square wafers in a 2x2 array.