| 摘要 |
An inspection apparatus is provided to improve a semiconductor device inspection yield by omitting an alignment unit from the inspection apparatus by minimizing a transfer range of a wafer chuck. An inspection apparatus(10) includes two wafer chucks(13), two probe cards, and an alignment unit(15). The wafer chucks are moved in X, Y, and Z directions. The probe cards are arranged on the wafer chuck. The alignment unit aligns a semiconductor wafer on one of the wafer chucks and the probe card. The alignment unit is shared by the wafer chucks. The alignment unit includes a first CCD(Charge Coupled Device) camera and an alignment bridge(15B). The alignment bridge is moved according to X and Y positions of the respective wafer chucks.
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