发明名称 |
MODULE FOR LIGHT EMITTING DIODE |
摘要 |
An LED module is provided to lengthen a lifetime of an LED by radiating smoothly heat through a metal case installed above an electrical circuit board. A case(100) includes outer walls(101-104) and a bottom surface having a groove(107) formed in one direction. The case is composed of a metal material. An electrical circuit board(200) includes a bottom surface which comes in contact with the bottom surface of the case except for the groove. A plurality of LEDs(203-206) are installed on an upper surface of the electrical circuit board. A resin layer is formed to seal the electrical circuit board except for light emitting sides of the LEDs. An area of the electrical circuit board is smaller than an area surrounded with the outer walls.
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申请公布号 |
KR100860594(B1) |
申请公布日期 |
2008.09.26 |
申请号 |
KR20080014009 |
申请日期 |
2008.02.15 |
申请人 |
ENLUX;AHN, JEONG SOO |
发明人 |
AHN, JEONG SOO;YUN, JAE DOO;KIM, KI WON;KIM, SANG HWAN |
分类号 |
H01L33/52;H01L33/48 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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