| 摘要 |
A method of snaking a connection between a wire and a contact pad using a wire bonding technique, wherein the wire and/or the substrate is/are coated with a composition that comprises one or more halo-hydrocarbon polymers at a thickness of from 1 nm to 2 pm. The coating may also comprise one or more monolayers of metal halide. The coatings allow bonding using metallic compositions which are susceptible to corrosion in non-inert environments containing oxygen. The removal of the coating material prior to bonding is optional. The bonding method is applicable to the formation ball/wedge and wedge/wedge bonds. |
