Device and method for pretreating electronic components before soldering

摘要

Reflow soldering apparatus for workpieces, e.g. electronic components, comprises a solder applicator (2), a component mounting unit (3) and a soldering zone (4). Atmospheric plasma treating units (5) are mounted upstream from the solder applicator and/or the soldering zone. An independent claim is included for a reflow solder method comprising atmospheric plasma treatment before solder application and/or soldering.