| 摘要 |
A semiconductor device package including multi-chips with a side-by-side configuration and a method of the same are provided to obtain a simple process for forming a semiconductor device package, to lower cost, to obtain higher yield rate and an excellent solution for a low pin count device. A semiconductor device package includes a substrate(102), a first die(104), a second die(132), a first adhesion material(106), a second adhesion material(107), bonding wires(112), and a dielectric layer(118). The substrate has die receiving through holes(105), connection through holes structure, first contact pads on an upper surface, and second contact pads on a lower surface of the substrate. The first die and the second die have first bonding pads and second bonding pads disposed within the die receiving through holes, respectively. The first adhesion material is formed under the first die and the second die. The second adhesion material is filled in a gap between the first and second dies and sidewalls of the die receiving through holes of the substrate. The bonding wires are formed to engage between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. The dielectric layer is formed on the bonding wires, the first die, the second die, and the substrate. |
