| 摘要 |
An image sensor package is provided to easily control an interval between image sensors by realizing an image sensors die on one package in a semiconductor package process. A circuit pattern is formed on a substrate(110). A pair of image sensors(130,130') are electrically connected to the circuit pattern. The image sensors are separated from each other at a regular interval to be mounted on the substrate. A signal processing unit(150) processes a signal generated by the image sensor. The signal processing unit generates a three-dimensional image. The substrate has a bonding pad. The image sensors are electrically connected to the bonding pad by a wire bonding. The substrate is a flexible printed circuit board. The respective image sensors have different lenses. An image sensor package includes an infrared ray light emitting unit. The image sensors are infrared ray sensors.
|
