| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition containing an amine imide as a photobase generating agent which efficiently generates a sufficiently strong base by heating together with a polyoxazole precursor and a photoacid generating agent, and to provide a method for manufacturing a relief and electronic parts having the relief. <P>SOLUTION: The photosensitive resin composition contains: (A) a polyoxazole precursor; (B) a compound which generates an acid by irradiation of radiation; and (C) an amine imide compound which generates a base by heating. The method for manufacturing a relief pattern includes a process of irradiating a coating film made of the above photosensitive resin composition patternwise with active rays and then developing and removing the irradiated portion with an alkali aqueous solution. The electronic parts have a heat-resistant insulating pattern obtained by heat treating the above relief pattern as a surface protective layer or an interlayer insulating layer. <P>COPYRIGHT: (C)2004,JPO |
