| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming an electrode penetrating an integrated circuit chip from the surface to the rear surface in order to mount three or more integrated circuit chips directly on a circuit board while stacking. <P>SOLUTION: A thin conductive semiconductor substrate is bored by etching and a photosensitive polyimide insulation film is deposited thereon by rotary coating. A pattern of holes of smaller diameter is then formed by exposure and development, the through hole is filled with a metallic material, and the rear surface of the substrate is ground to expose the metal thus forming a through electrode. The inventive through electrode has such a structure as a polyimide insulation layer is formed on the side face of a through hole made through a substrate of ground potential and the center of the hole is filled with a metallic material. Since a coaxial line structure is attained, a wide range characteristic impedance can be realized by controlling the thickness of the polyimide insulation film on the side face of the hole. <P>COPYRIGHT: (C)2003,JPO |
