STACK PACKAGE AND METHOD FOR FABRICATING THEREOF

摘要

A stack package and a method for manufacturing the same are provided to dissipate heat generated from a first ball grid array package and a second ball grid array package by forming a heat sink and a coupling member. A first ball grid array package(100) has a printed circuit board(120) extended to both sides. A connecting layer(200) is formed on an upper portion of the first ball grid array package. A circuit pattern is formed on an upper surface of the connecting layer. A second ball grid array package(300) is formed on an upper portion of the connecting layer. A solder ball of the second ball grid array package is bonded to the circuit pattern of the connecting layer. A heat sink(400) is formed on an upper portion of the second ball grid array package. A bonding wire(500) electrically connects the first ball grid array package to the connecting layer. A coupling member(600) is formed along an edge of an upper portion of the printed circuit board and a lower portion of the heat sink. A resin sealing member(700) is formed in a space sealed by the coupling member to wrap the first ball grid array package and the second ball grid array package.