| 摘要 |
A semiconductor package and a method for manufacturing the same are provided to easily manufacture high pin counts of four or more rows by forming a land in a hole with copper. A die pad(121) of a copper foil is formed on a center of a lead frame. A semiconductor chip(140) is adhered to the die pad. Plural copper foiled wire bonding pads(130) are arranged at an outer circumference of the die pad in a matrix form. The semiconductor chip is attached to the die pad. A conductive wire(170) connects an electrode terminal of the semiconductor chip to the wire bonding pad. A molding(150) gap-fills the semiconductor chip, the die pad, the wire bonding pad, and a wire with an epoxy molding compound. An insulating film(110) is arranged on a lower surface of the copper foiled lead frame. The insulating film is attached to the die pad and the wire bonding pads. A hole is formed on a surface of the insulating film so that a part of the lower surface of the wire bonding pad is exposed. The hole of the insulating film is processed by using a laser drilling manner. |
