发明名称 |
GLASS PACKAGE THAT IS HERMETICALLY SEALED WITH A FRIT AND METHOD OF FABRICATION |
摘要 |
<p>A hermetically sealed glass package preform is provided comprising a glass substrate; a frit comprising 65-100 wt. % of a base glass and about 0-35 wt. % of a filler; wherein the base glass comprises: about 0-5 mole % K2O; about 0-35 mole % Sb2O3; about 0-20 mole % ZnO; about 10-40 mole % P2O5; about 10-60 mole % V2O5; about 0-5 mole % TiO2; about 0-5 mole % B2O3; about 0-5 mole % SiO2; about 0-5 mole % WO3; and about 1-10 mole % of a metal oxide selected from the group consisting of Fe2O3, Nd2O3, La2O3, Ce2O4, Pr6O11, Er2O3, and CeO2; wherein the base glass has a mean particle size distribution of less than about 3 mum; and wherein the filler has a mean particle size distribution of between about 3 and 7 mum. The frit is sintered in an atmosphere less oxidizing than air at a temperature of between about 390° C. to 415° C.</p> |
申请公布号 |
EP1971558(A2) |
申请公布日期 |
2008.09.24 |
申请号 |
EP20060838615 |
申请日期 |
2006.11.28 |
申请人 |
CORNING INCORPORATED |
发明人 |
LAMBERSON, LISA, A.;MORENA, ROBERT, M. |
分类号 |
C03C3/21;C03C8/24;H05B33/04 |
主分类号 |
C03C3/21 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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