| 摘要 |
A mounting means and a method for fabricating a semiconductor device package are provided to improve soldering reliability of a semiconductor device package. A mounting means for a semiconductor device package comprises a core portion having a first plane and a second plane facing the first plane; and a first and second bonding material layers provided to the first and second planes of the core portion, respectively, in which the core portion, and the first and second bonding material layers each have holes corresponding to an alignment of bonding pads(112) of the semiconductor device being mounted. |
