| 摘要 |
PROBLEM TO BE SOLVED: To provide a fine structure transfer device which can transfer the fine structure exactly at a desired position of a substrate by mounting the substrate and a stamper exactly on a stage. SOLUTION: In the fine structure transfer device, the substrate 11 and the stamper 10 are mounted on the flat substrate installation surface Sa of the stage 13 to face each other, and the substrate 11 is die-pressed with the stamper 10 to form a desired uneven pattern on the substrate. A provisional installation surface Sb for the substrate 10 and the stamper 11 which are arranged at positions higher than the substrate installation surface Sa of the stage 13 is provided. A provisional placement members 25-27 are set, which move the provisional installation surface Sb gradually to the same plane position as the substrate installation surface Sa of the stage 13 when the substrate 11 and the stamper 10 are mounted on the provisional installation surface Sb. COPYRIGHT: (C)2006,JPO&NCIPI |
