发明名称 RESIN SEALING NETHOD, MOLD FOR RESIN SEALING, AND RESIN SEALING APPARATUS
摘要 A resin sealing method, a mold for resin sealing, and a resin sealing apparatus are provided to improve production efficiency in a resin sealing process without increase of equipment cost and to resin-seal one surface or both surfaces of a sheet member. A resin sealing method includes the steps of: disposing an intermediate mold having a cavity portion(3,4) in which a resin sealed material is received between an upper mold(1) and a lower model(2); and introducing sealing resin into the cavity portion of the intermediate mold and another main surface of the intermediate mold via a runner(24,27) provided in the vicinity of the cavity portion of the intermediate mold to pierce the intermediate mold in a thickness direction. A plurality of intermediate molds is disposed to be stacked between the upper mold and the lower mold. The runner is disposed in the vicinity of cavity portions of the stacked intermediated molds. The sealing resin is introduced into the cavity portions of the intermediate molds through the runner.
申请公布号 KR20080085734(A) 申请公布日期 2008.09.24
申请号 KR20080024802 申请日期 2008.03.18
申请人 FUJITSU MICROELECTRONICS LIMITED 发明人 NISHIMURA TAKAO;KOSAKAI KAZUNARI
分类号 H01L21/56;H01L23/28 主分类号 H01L21/56
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