发明名称 |
Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package |
摘要 |
Provided are semiconductor low-K Si die wire bonding packages with package stress control and fabrication methods for such packages. The packages include molding interface material applied onto the low-K Si die. In general, the molding interface material is selectively applied onto the low-K Si die surface in order to minimize to safe levels the package stress experienced by the low-K Si die. Selective application includes defining various combinatorial patterns of coated and non-coated regions. In addition, selective application may also include a general application of molding interface material to create a stress buffer zone. The results are packages with less stress experienced by the low-K Si die and so improved reliability (in compliance with industry specifications).
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申请公布号 |
US7427813(B1) |
申请公布日期 |
2008.09.23 |
申请号 |
US20030719218 |
申请日期 |
2003.11.20 |
申请人 |
ALTERA CORPORATION |
发明人 |
WANG WEN-CHOU VINCENT;LI YUAN |
分类号 |
H01L29/40;H01L23/28;H01L23/29 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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