发明名称 |
Flow diffuser to be used in electro-chemical plating system |
摘要 |
An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.
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申请公布号 |
US7427338(B2) |
申请公布日期 |
2008.09.23 |
申请号 |
US20030609862 |
申请日期 |
2003.06.30 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
DORDI YEZDI N.;STEVENS JOSEPH J.;HEY H. PETER W.;OLGADO DONALD J. K. |
分类号 |
C25D5/08;C25D17/02;C25D7/12;C25D17/00;H01L21/288;H05K3/24 |
主分类号 |
C25D5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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