SEMICONDUTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor device and a manufacturing method thereof are provided to suppress an erosion effect and to define an alignment mark by increasing a thickness of conductive material deposited in a dummy region. A chip region and a dummy region are defined on a substrate(10). An insulating layer is formed on the substrate. A plurality of via-holes(30) are formed in the insulating layer corresponding to the chip region. The via-holes are filled with conductive material. A recess(40) is formed on the insulating layer corresponding to the dummy region. The recess is filled with conductive material(50). The thickness of the conductive material filled in the recess is 1.5 to 3 times to the width of the via hole.