发明名称 Deposited thin films and their use in separation and sacrificial layer applications
摘要 This invention uses large surface to volume ratio materials for separation, release layer, and sacrificial material applications. The invention outlines the material concept, application designs, and fabrication methodologies. The invention is demonstrated using deposited column/void network materials as examples of large surface to volume ratio materials. In a number of the specific applications discussed, it is shown that it is advantageous to create structures on a laminate on a mother substrate and then, using the separation layer material approach, to separate this laminate from the mother substrate using the present separation scheme. It is also shown that the present materials have excellent release layer utility. In a number of applications it is also shown how the approach can be used to uniquely form cavities, channels, air-gaps, and related structures in or on various substrates. Further, it is demonstrated that it also can be possible and advantageous to combine the schemes for cavity formation with the scheme for laminate separation.
申请公布号 US7427526(B2) 申请公布日期 2008.09.23
申请号 US20010836449 申请日期 2001.04.17
申请人 THE PENN STATE RESEARCH FOUNDATION 发明人 FONASH STEPHEN J.;NAM WOOK JUN;LEE YOUNGCHUL;CHANG KYUHWAN;HAYES DANIEL J.;KALKAN A. KAAN;BAE SANGHOON
分类号 H01L21/00;B81B3/00;B81C1/00;G01N21/17;G01N27/447 主分类号 H01L21/00
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