发明名称 Micro-sensor
摘要 A microsensor includes a sensor element, such as a micromechanical sensor element, and a first integrated circuit. The first integrated circuit includes a semiconductor body and a second integrated circuit. The sensor element is on a main surface of the semiconductor body. A eutectic connection couples the semiconductor body and the sensor element.
申请公布号 US7427808(B2) 申请公布日期 2008.09.23
申请号 US20040494027 申请日期 2004.11.22
申请人 AUSTRIAMICROSYSTEMS AG 发明人 BRANDL MANFRED;CSERNICSKA ROBERT
分类号 H01L23/34;B81C1/00;B81C3/00;G01P1/02;G01P9/04;G01P15/08;G01P15/125;G01P15/13 主分类号 H01L23/34
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