发明名称 |
Method of making an electronic device cooling system |
摘要 |
A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer and plating the sacrificial layer to substantially fill the plurality of channels with a plating material comprising conducting material. The method also includes etching the sacrificial layer to form a conducting structure having fins where conducting material remains separated by microchannels where the sacrificial layer is etched.
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申请公布号 |
US7427566(B2) |
申请公布日期 |
2008.09.23 |
申请号 |
US20050297868 |
申请日期 |
2005.12.09 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
DUROCHER KEVIN MATTHEW;GOODWIN STACEY JOY;BALCH ERNEST WAYNE;KAPUSTA CHRISTOPHER JAMES |
分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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