| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem in a conventional method of filling a through-hole, which includes filling the inside of the through-hole with a plating metal through an electrolytic metal plating process with the use of an electrolytic plating solution, which needs to a great attention to the control. SOLUTION: This filling method includes the steps of: forming a metallic thin film 14 on the whole area of a substrate surface including the inner wall surface of the through-hole 12 which penetrates through a substrate 10 made from an insulation material; covering one surface side of the substrate 10 in which one of open parts of the through-hole 12 is opened, with a first insulation film 16; forming a plated metal layer 18 on the other side of the substrate 10 in which the other open part of the through-hole 12 is opened, so as to block the other open part of the through-hole 12 while filling the other open part side of the through-hole 12 with the plating metal, through a first electrolytic metal plating step which uses the metallic thin film 14 as a power-feeding layer; subsequently peeling the first insulation film 16 and opening the one side of the open part of the through-hole 12; and forming a plated film on the one surface side of the substrate 10 so as to fill a space 12a remaining in the one open part side of the through-hole 12 with a plating metal through a second electrolytic metal plating step which uses the metallic thin film 14 as the power-feeding layer. COPYRIGHT: (C)2008,JPO&INPIT
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