发明名称 CUTTING METHOD OF CONDUCTIVE MEMBER, AND METHOD FOR MANUFACTURING CIRCUIT DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cutting method of conductive member for easily and surely cutting a conductive member to be guided to external side and also provide a method for manufacturing a circuit device. <P>SOLUTION: A lead 14 guided to a side from a resin sealing body 12 is cut at the predetermined position using a die 38 formed of an upper die 40 and a lower die 42 and a punch 44. In actuality, the lead 14 guided to external side from the resin sealing body 12 is pressed and fixed in the thickness direction with the upper die 40 and the lower die 42. Next, the metal punch 44 is moved to the lower side from the upper side to place an abutting part 46 provided at the lower end of the punch in contact with the upper surface of the lead 14. Moreover, the lead 14 is cut at the predetermined position by moving the punch 44 to the lower side. Accordingly, since the lead 14 is never carried and moved in the process of cutting the lead 14, various problems caused by displacement due to transfer or the like can be avoided. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008218525(A) 申请公布日期 2008.09.18
申请号 JP20070050582 申请日期 2007.02.28
申请人 SANYO ELECTRIC CO LTD;SANYO SEMICONDUCTOR CO LTD 发明人 KAMIKAWA MASAHIRO;YOSHIBA SHIGEJI
分类号 H01L23/50 主分类号 H01L23/50
代理机构 代理人
主权项
地址