发明名称 METHOD FOR MANUFACTURING MESH-LIKE METAL PARTICLE MULTI-LAYER SUBSTRATE AND TRANSPARENT CONDUCTIVE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a mesh-like metal particle multi-layer substrate excellent in transparency and moire resistance with good productivity, a mesh-like metal particle multi-layer substrate, and a transparent conductive substrate using it. SOLUTION: The method for manufacturing a mesh-like metal particle multi-layer substrate laminates a metal particle layer on a substrate like a mesh by coating a metal particle solution on at least one surface of the substrate. In this case, the humidity on the substrate is kept at 1-85%RH in the course at least from a coating start of a metal particle solution to its coating finish. The mesh-like metal particle multi-layer substrate is manufactured by such manufacture method and is used for the transparent conductive substrate. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008218860(A) 申请公布日期 2008.09.18
申请号 JP20070056810 申请日期 2007.03.07
申请人 TORAY IND INC 发明人 OHASHI JUNPEI;TANAKA SHOTARO;TAKADA HAGUMU
分类号 H05K9/00;B32B15/02;G09F9/00 主分类号 H05K9/00
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