发明名称 |
Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device |
摘要 |
A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.
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申请公布号 |
US2008227226(A1) |
申请公布日期 |
2008.09.18 |
申请号 |
US20080153481 |
申请日期 |
2008.05.20 |
申请人 |
FUJITSU LIMITED |
发明人 |
FUJII SHIGERU;ARISAKA YOSHIKAZU;IZURU HITOSHI;TASHIRO KAZUHIRO;MARUYAMA SHIGEYUKI |
分类号 |
H01L21/66;H01L21/304 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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