SURFACE ANALYSIS APPARATUS OF WAFER POLISHING PAD AND SURFACE ANALYSIS METHOD THE SAME

摘要

An apparatus for analyzing a surface of a wafer polishing pad and a method for analyzing the surface of the wafer polishing pad using the same are provided to inspect a surface of the pad by extracting a contact rate between the pad and a plate. A flat plate(206) is loaded on an upper surface of a pad(200). A pressure unit(202) applies predetermined pressure to the flat plate unit. A plate pushing unit(204) fixes and presses an edge region of a flat plate. An optical measurement unit(208) measures a contact area between the pad and the flat plate by measuring intensity of light reflected from an interface between the pad and the flat plate. A control unit(210) compares a predetermined reference range with the contact area between the pad and the flat plate which is measured through the optical measurement unit.