| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing an effect that wiring on a mounting board influences high-frequency wiring on a semiconductor chip. SOLUTION: The semiconductor device 1 includes the semiconductor chip 10 and the mounting board 30. The semiconductor chip 10 has a semiconductor substrate 12, a wiring layer 14, and the high-frequency wiring 16 in such a way that the wiring layer 14 is formed on the semiconductor substrate 12 and that the high-frequency wiring 16 is formed in the wiring layer 14. The semiconductor chip 10 is mounted facedown on the mounting board 30. An electromagnetism cutoff layer 40 is formed between the high-frequency wiring 16 and wiring 34 in the mounting board 30. COPYRIGHT: (C)2008,JPO&INPIT
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